About the job

The Principal Packaging Engineer role at IC Resources in Newport involves leading the development of next-generation 2.5D and 3D semiconductor packaging technologies. Responsibilities include architecting innovative 2.5D/3D packaging solutions from concept to prototype, leading advanced packaging R&D programmes, overseeing design, assembly, test, and validation of complex semiconductor packages, collaborating across teams to solve system-level packaging challenges, and representing the company in technical discussions, bids, and industry forums. The ideal candidate will have strong experience in semiconductor package design and development (3D/2.5D), a proven track record in leading microelectronics packaging projects, deep understanding of design, modeling, and validation processes, and excellent communication, leadership, and problem-solving skills. The position offers a competitive salary, 15% pension (10% employer), annual bonus, private medical cover extended to family, and visa sponsorship including up to £5,000 relocation support, making it an excellent opportunity for experienced semiconductor packaging engineers.